Advanced Manufacturing Capabilities

Layers: 1–30 layers
Base Materials: FR4 (Shengyi China, ITEQ, KB A+, HZ), High-TG, FR06, Rogers, Taconic, Argon
Copper Thickness: 1–6 OZ
Product Types: High-Frequency (HF) & Radio Frequency (RF) boards, impedance-controlled boards, HDI boards, BGA & fine-pitch boards
Board Thickness: Double-sided 0.2–7.0 mm, Multilayer 0.40–7.0 mm

Standard Finishes: Conventional HASL, Lead-free HASL, Flash Gold, ENIG (Immersion Gold), OSP (Entek), Immersion Tin, Immersion Silver, Hard Gold

Selective Surface Treatment:
ENIG + OSP | ENIG + Gold Finger | Flash Gold + Gold Finger | Immersion Silver + Gold Finger | Immersion Tin + Gold Finger

Solder Mask: Nanya & Taiyo LPI, Matt finish in Red, Green, Yellow, White, Blue, Black

• Minimum line width/gap: 3.5/4 mil (laser drill)
• Minimum hole size: 0.15 mm (mechanical) / 4 mil (laser)
• Minimum annular ring: 4 mil
• Max copper thickness: 6 OZ
• Max production size: 900 × 1200 mm
• Min solder mask bridge: 0.08 mm
• Aspect ratio: 15:1
• Plugging via capability: 0.2–0.8 mm

Dimensional Tolerances:

• Plated holes: ±0.08 mm (min ±0.05 mm)
• Non-plated holes: +0/-0.05 mm or +0.05/-0 mm
• Outline: ±0.10 mm

Electrical & Mechanical:

• Insulation resistance: 50 Ω (nominal)
• Peel-off strength: 1.4 N/mm
• Thermal stress test: 265°C, 20 seconds
• Solder mask hardness: 6H
• E-Test voltage: 500 V +15/-0 V, 30 s
• Warp and twist: ≤ 0.7% (semiconductor ≤ 0.3%)

PCB Fabrication Flexibility: 1–16 layer PCBs in-house; complex boards outsourced to stable partner factories with guaranteed quality.

Part Supply Flexibility:

• Turn-key — we source all components from authorized suppliers
• Partial Turn-key — you supply preferred parts, we source the rest
• Consigned — customer-supplied components accepted in reels, cut tape, tube & tray, loose parts, and bulk

Assembly Flexibility: SMT, THT & Hybrid, single or double side placement. Lead and lead-free (RoHS compliant) options. Rigid, flex, and rigid-flex boards.

Board Size: Min 10×10 mm (panelized) to max 330×530 mm. No shape restrictions — rectangular, circular, and odd shapes supported.

Component Handling:

• Passive components as small as 01005, 0201, 0402
• Active components from 0.25 mm pitch
• BGA ≥ 0.25 mm pitch, Package-on-Package
• Cable & wire assembly

Volume Flexibility:

• Prototypes — MOQ as low as 5 units in 1–2 days
• Low volume — 3–4 day quick-turn service
• High volume — accurate delivery to meet your deadlines

Stencils: Laser-cut stainless steel provided for all orders.

Certifications: ISO9001 certified production facilities

Inspection Standard: IPC-610-D Class 2/3

Quality Metrics:

• Production pass rate: ≥ 99.5%
• Quality complaint rate: ≤ 0.1%
• Repair & rework: BGA reballing service available

Advanced Testing Equipment:

• Visual Inspection — general quality check
• AOI Testing — solder paste, 0201 components, missing parts, polarity
• X-ray Inspection — BGA, QFN, and bare board verification
• KIC Thermal Profiling — furnace temperature controlled within ±0.1°C
• ICT (In-Circuit Test) — automated electrical verification
• Functional Test — customized per product requirements